Filler Alloys and Consumables from RS Components, Ltd.

3143289

 
 
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De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is designed for removing solder from BGA pads and chips
Width = 0.8mm
Length = 1.5m
No Clean = Yes


Specifications

Manufacturer
ITW Chemtronics
Manufacturer Part Number
60-1-5
Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Desoldering Wicks & Braids
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