This resin-based solder wire is a 60/40 tin/lead solder wire, with the solder flux formulated for wetting all common Printed Circuit Boards (PCBs) and components. The residue left after soldering is clear and can be safely left on the PCB after soldering is complete.
Versatile solder wire that is ideal for a varied range of soldering tasks. Solder wire alloy contains 60% tin and 40% lead, conforming to J-STD 006. Melting point is between 183-188°C . 2.2% flux content. Typical temperature for soldering iron tip is 320-360°C for use with this solder
Wire Diameter = 1mm
Percent Lead = 40%
Product Form = Wire
Melting Point = +183°C
Percent Tin = 60%
Flux Type = Refined Resin- REL0
Product Weight = 500g
Flux Content Percent = 2 - 4%