Filler Alloys and Consumables from RS Components, Ltd.

5125801


 
 
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5125801-Image

High purity extruded solder alloy containing 99.3% tin & 0.7% copper, suitable for solder baths or pots.
Less dross on initial melting. More solder joints weight for weight. Improved wetting of electronic components & PCBs. Melts at 227°C. Stick weight 80 g
Product Form = Stick
Melting Point = +227 - +240°C
Percent Tin = 80 - 100%
Product Weight = 80g
Percent Copper = 0.1 - 1%


Specifications

Manufacturer
Henkel North America
Manufacturer Part Number
761345
Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Solid wire or rod; Stick
Melting Range
441 to 464 F (227 to 240 C)
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