Filler Alloys and Consumables from RS Components, Ltd.
3143318




De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time. Minimises the risk of damage to the board. Patented non-corrosive, halide free, organic no-clean flux. BGA desolder braid is designed for removing solder from BGA pads and chips
Width = 3.7mm
Length = 1.5m
Specifications
Manufacturer
ITW Chemtronics
Manufacturer Part Number
80-5-5
Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Desoldering Wicks & Braids