Filler Alloys and Consumables from RS Components, Ltd.

518062

 
 
518062 -- View Larger Image
518062-Image

Sn60Pb39Cu1 alloy with flux core. Reduced wear of soldering iron tips, thus more productive soldering of copper wires. Solidus at 183 °C, liquidus at 215 °C. Flux content of 3.5%
Wire Diameter = 0.5mm
Percent Lead = 40%
Product Form = Wire
Percent Tin = 60%
Product Weight = 250g


Specifications

Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Solid wire or rod
Diameter / Thickness
 
Solder Alloy
 
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