This solder wire from RS is a resin-based, SAC305 lead free solder wire that utilises a synthetically refined resin and effective activator package. The alloy used in this solder wire conforms to J-STD 006 and contains 96.5% tin, 3.0% silver and 0.5% copper. The flux formulation of this solder wire is ideal for wetting common Printed Circuit Boards (PCBs) and any components as it leaves behind a clear residue that can be easily removed with dry brushing for a cleaner look or safely left on the PCB after soldering.
Wire Diameter = 1.2mm
Product Form = Wire
Melting Point = +217 - +219°C
Percent Silver = 3%
Percent Tin = 96.5%
Flux Type = Refined Resin- REL0
Product Weight = 250g
Flux Content Percent = 3.3%
Percent Copper = 0.5%