Filler Alloys and Consumables from RS Components, Ltd.

555197


 
 
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555197-Image

No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free.
Product Form = Paste
Melting Point = +217 - +219°C
Percent Silver = 3%
Percent Tin = 96.5%
Flux Type = Resin
Percent Copper = 0.5%


Specifications

Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Braze or solder in the form of a paste.
Melting Range
 
Solder Alloy
 
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