Filler Alloys and Consumables from RS Components, Ltd.


5064302 -- View Larger Image

Unleaded, No-Clean, Halide-free, pin-testable, humidity resistant solder paste, ideal for Electronics Lead-Free processes & re-work.
Wide print process and reflow windows. Long abandon time. Low slump. Clear colourless residues. High tack & SIR. Particle size 20-45µm. No corrosion. Supplied in 500g tubs
Lead Free = Yes
Package Type = Tub
Package Size = 500g


Henkel North America
Manufacturer Part Number
Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Braze or solder in the form of a paste.
Solder Alloy
Lead Free
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