ALPHA^® EF-3001, is a resin/rosin containing, VOC-free, low solids, no-clean flux which provides the highest activity of any VOC-free Bellcore compliant flux for defect-free soldering. It is formulated with a proprietary mixture of resin/rosin and organic activators. ALPHA^® EF-3001 delivers excellent wetting and topside hole fill, even with OSP coated bare copper boards and superior reliability. Several proprietary additives are also formulated into ALPHA^® EF-3001, which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of ALPHA^®EF-3001 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.