ALPHA® JP-500 is a lead-free, no-clean solder paste designed for use in Jet Printers. ALPHA JP-500 features a rheology capable of standard dispensing or jetting. ALPHA JP-500 is formulated to offer best in class in circuit pin test yields, high electrical reliability, all in a zero halogen flux formulation.
Outstanding reflow process window delivers good soldering on CuOSP, lead free HASL, Immersion Silver, Immersion tin and ENIG surface finishes. ALPHA JP-500 is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA JP-500 is rated ROL0 per IPC J-STD-004.