EF-6103 is an alcohol based flux designed to optimize solderability and reliability. It is formulated for both standard and thicker, high-density PCBs in both Lead-free (standard SAC and Low Ag SAC alloys) and eutectic SnPb processes. It is designed to have low bridging on bottom side QFPs, as well as provide superior performance in pin testing, hole-fill and solderballing. Additionally, it provides good Lead-free solder joint cosmetics with an evenly spread, tack free residue.