PoP Paste Indium9.91 is a no-clean solder paste designed for use in package-on-package (0.3mm and larger) applications. PoP Paste Indium9.91 has a rheology designed to provide a long-lasting dipping process.

Features:

• Eliminates defects due to package-warping
• Air-reflow
• Rheology optimized for both dipping and package-retention
• Designed for use with SAC305 and Sn63/Pb37 alloys
• Excellent solderability
• Long pot life
• Suitable for use down to 0.3mm pitch