- Designed for flip-chip dipping applications
- Tackiness suitable for holding die during assembly
- Bubble-free airless packaging
- Ultra-low residue
Flip-Chip Flux NC-26-A is a halogen-free, no-clean flipchip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.