NC-SMQ®71 is a dispensing solder paste designed and formulated specifically for die attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. NC-SMQ®71 is formulated for reflow in nitrogen atmospheres of 500ppm oxygen or less and leaves a completely benign residue of only 2% of paste or 20% to 25% of flux/vehicle. NC-SMQ®71 is halogen-free and meets ANSI/JSTD-004 and -005 criteria, as well as Bellcore electromigration specifications.