NC-SMQ® 80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys offer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or silver, and improved ductility to compensate for coefficient of thermal expansion (CTE) mismatches between dissimilar materials. NC-SMQ80 is a medium residue, air-reflow paste with exceptional wetting capabilities. NC-SMQ80 meets or surpasses all ANSI/J-STD-004, -005 and Bellcore test criteria.