Indium10.2HF is a no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. The flux residue is formulated to be hard and fast breaking, yet non-tacky after reflow, in order to provide extraordinary flying probe and in-circuit testing (ICT) performance. Indium10.2HF provides excellent head-in-pillow (HIP) and non-wet-open (NWO) resistance along with offering unprecedented stencil print transfer efficiency to work in the broadest range of processes.