Our fluxes for flip-chip bonding applications are halide-free. They are designed for both air and nitrogen reflow and may be purchased individually or in a research kit. The no-clean and water-soluble fluxes are available in two series: LT and HT.

Series LT is for high-performance eutectic soldering, such as SnPb and Pb-free.

Series HT is designed for high Pb-containing solder alloys with a high melting point.

Each series consists of fluxes with different viscosities and specifications depending on the processing conditions. For example, a flux with low or medium viscosity can be sprayed onto substrates followed by flip-chip placement. These fluxes can also be dispensed onto the side of the flip-chip, allowing the flux to wick across the bottom of the chip. Fluxes with higher viscosities can be printed onto the pads, or the chip can be dipped into the flux prior to placement.