Filler Alloys and Consumables from Indium Corporation
Semiconductor Solder Paste -- PoP Paste Indium9.88-HF
PoP Paste Indium9.88-HF is a no-clean solder paste designed for use in package-on-package (0.4mm and larger) applications. PoP Paste Indium9.88-HF has a rheology designed to provide a long-lasting dipping process.
Specifications
Product Category
Filler Alloys and Consumables
Joining Process / Product Form
Braze or solder in the form of a paste.
More Information
Similar Products
