Henkel Corporation - Electronics LOCTITE DA 100

  • LOCTITE DA 100 - Henkel Corporation - Electronics
    Henkel Corporation - Electronics
Description
Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb formulation

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LOCTITE DA 100 - - Henkel Corporation - Electronics
Henkel Corporation - Electronics
Irvine, CA, USA
LOCTITE DA 100
LOCTITE DA 100
Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb formulation

Halide-free, No-clean, Pb-freeDispensing grade solder paste intended for die attach applications. Provides effective thermal control for copper leadframe power semiconductor devices. Suitable for automotive and consumer packages.Also available in SnPb formulation

Supplier's Site

Technical Specifications

  Henkel Corporation - Electronics
Product Category Filler Alloys and Consumables
Product Name LOCTITE DA 100
Joining Process / Product Form Braze or solder in the form of a paste.
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