H.C.C. International provides PCB manufacturing services, including quick-turn prototyping and mass production of single-sided, double-sided, and multilayer printed circuit boards. It offers small and medium-sized batch production of PCBs and can produce 1-32 layers. The company serves more than 100 countries and tens of thousands of customers around the world.

Board Types

• Multilayer PCB: 1-32 layers; surface finishes include gold-plated, OSP, silver, gold, tin, and tin plate; materials include FR-4, aluminum substrate, cardboard, and semi-glass fiber (CEM-1)
• Special process requirements: custom production services, supported by a strong engineering team and advanced production equipment
• Aluminum plate: aluminum substrate/mixed aluminum substrate with thermal conductivity of 1-3W; aluminum plate with high thermal conductivity insulating material; up to 8 layers of mixed-pressed aluminum substrates
• Copper substrate: thick copper plate/bare copper plate with thermal conductivity of 2-3W; thermoelectric separation process; 100% computer open and short circuit test; high heat dissipation performance for radiators, power supplies, etc.
• FPC flexible board: 1~8 layers of rolled copper/electrolytic copper; can be used for soft and hard combination, FPC multi-layer board, cable, etc.
• High precision PCB board: minimum line width and line spacing 3/3mil; minimum via 0.15mm; solder mask bridge and via hole plugging technology; impedance requirements, electric golden fingers, precise lines, etc.

PCB Production Process Capability

• Layers: single-sided/double-sided/multi-layer (4-32 layers)
• Material: common FR-4 (Medium TG High TG), CEM-1; special CEM-3, Rogers
• Surface treatment: lead-free HASL, immersion nickel gold, gold plating, organic solder protection film (OSP)
• Special processes: impedance board (impedance requirement within ±10%); high copper thick plate (copper thickness of inner and outer layers 3-4 OZ); high TG board/halogen-free board/halogen-free high TG board
• Processed plate thickness: 0.4-3.2mm
• Processing size: maximum 600MM X 600MM; minimum 5MM X 5MM
• Minimum aperture: 0.1mm
• Minimum line width and line spacing: 0.125mm
• Plate thickness aspect ratio: 1:8 within
• Minimum annular ring: 0.2mm
• Outer copper thickness: 18µm, 35µm, 70µm, 105µm, 140µm
• Solder mask oil film type: liquid photosensitive solder resist ink
• Solder resist ink color: photosensitive series in green, black, red, yellow, white, blue, orange, etc.; matt series in green and black; sun ink
• Shape processing method: die stamping, CNC
• Tolerance: line width ±10%, aperture +3Mil, shape processing ±0.15MM (special process to be determined separately)
• Coating thickness: HASL copper thickness 18-25um, tin thickness 5-40um; immersion gold plate nickel thickness 2.5-5µm, gold thickness 0.05-0.1µm; OSP board film thickness 0.2-0.5um
• Warpage: ≤0.75%