Interplex offers complete solutions from concept through development and into scalable high-volume production for almost any electronic packaging application. Interplex's network of engineers develop solutions that fit the manufacturing needs of our customers and then match up those needs with the best Interplex production facility.
Today, Interplex continues to expand its technologies and capabilities from developing solutions for high-speed data and micro packaging requirements to high-current, thermally efficient packaging for power generation and conversion in applications such as RF Power and Hybrid technologies. Interplex is always driven by the singular mission to deliver innovative solutions and services to our customers.

APPLICATIONS:

• Sensor Housings
• RF, Hybrid, Converters & Solar Devices
• UV & Light Detectors
• RFID & Security Tags
• Tire Pressure Housings
• Component Holders
• Ceramic Interconnects
• Microelectronics
• Semiconductor Packages

MARKETS:

• Automotive
• Military
• Aerospace
• Industrial
• Consumer Electronics
• Medical