Entech Electronics China provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house and contract partners include the following capabilities:

Component Procurement & Management Service

· Domestic and International supply lines.

· Procurement teams in Shenzhen and Australia.

· Customs arrangements and documentation for importation of client supplied components (FIA) available.

· Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables.

· Metal fabrication, casting and extrusion, including all finishes and pad printing.

· Plastics tooling and manufacture.

Assembly facilities

· Entech partners with 4 assembly facilities as well as in-house capabilities to provide any volume requirement.

· Lead free processing.

· Through Hole Assembly Lines.

· Dual Wave, Wave Soldering machine.

· Fine Pitch QFP to .02" (0.5mm).

· BGA to .01" (0.3mm).

· Chip components 0201.

· PCB size 1.18"-20" (30-510mm).

· Mixed technology assembly.

· Mechanical and box build assembly.

Testing

· MDA (Bed of Nails using HP3065 & HP3070).

· Full functional testing using dedicated Jigs and fixtures.

· Functional testing (Teradyne A360, Geotester).

· X-Ray and Optical inspection facility for BGA placement.

· PC based test systems (Dedicated, JTAG/Boundary Scan).

Turnkey product manufacturing

· Total product build.

· Packaging and warehousing including manuals, CDs, literature and cartons.

· Shipping direct to the end user.

Other services

· Design advice on suitability for manufacture (DFM).

· Engineering support including PCB layouts and design.

· Production tooling and test jig design and manufacture.