- Multi-tool functionality including thickness, shape stress, global and site flatness measurements
- Measures 8,700 data points in under 60 seconds
- Thin film stress on patterned or monitor wafers
- Wide range of options including wafer typing
The 9500 UltraGage is a versatile, multifunctional measurement tool that measures wafer thickness, shape and site flatness. Using the industry standard E-Gage technology, the 9500 UltraGage measurement tool is ideal for characterizing wafers used by mature fabrication processes. Applications include outgoing wafer quality checks at silicon wafer manufacturers, sampling incoming wafer quality at IC fabs, thin film stress measurements and shape of wafers used in thermal processes. High data density, non-contact measurements and fully automated operation make the 9500 UltraGage measurement tool an ideal full functional analysis, development and control tool. A wide selection of optional capabilities including wafer typing, stress measurement and off-line analysis software allow the 9500 UltraGage measurement tool to be used in a wide variety of applications.
As either a standalone gage, or with its optional cassette handler, the 9500 UltraGage measurement tool offers a variety of measurements not usually found in a single tool. Thickness, shape, global and site flatness measurements can be used in many applications from incoming quality control to backgrind. Moreover, stress and off-line analysis software can be added eliminating the need to purchase a separate stress measurement tool.
Site Flatness Measurement
Standard on the 9500 UltraGage measurement tool, real time site flatness measurements can be used to qualify wafers for their suitability for lithographic processes. Site size and offset can be varied to qualify the flatness of user specific image layouts, preventing out of specification wafers from entering the IC fabrication process.
The 9500's optional stress measurement is not sensitive to film type, reflectivity or other optical aberrations found in optically based stress measurement systems. The large number of data points results in highly detailed stress measurements to within 3 mm from the edge.