- The standard for wafer dimensional measurements
- High performance metrology
- Configurable multi-cassette sorting capabilities
- Wide variety of options including fully automated calibration
The UltraScan 9600 system, with E-Plus Gage technology, is the industry standard for applications demanding 250nm wafer characterization and sorting. It meets SIA performance requirements for 250nm design rule site flatness and edge exclusion. With available resistivity and typing gages, the 9600 is ideal for high volume production environments at both wafer manufacturers and IC fabs.
The UltraScan 9600 tool is the standard for high volume dimensional metrology in the silicon wafer industry. With E-Plus Gage capacitive technology and E-Gage technology emulation, the 9600 characterizes wafers for 250nm and greater line widths. The increased accuracy and repeatability of the 9600 translates into higher yield at final inspection. Five configurable cassette stations enable the 9600 to sort wafers based on a number of user defined parameters including thickness, shape and site flatness. Resistivity and typing can be added to completely define the dimensional and base electrical properties of outgoing material. AGV compatible load stations can also be added to facilitate factory automation.
Incoming Quality Control
The clustered design of the 9600 enables sampling of wafer dimension, shape, flatness, resistivity and type in one metrology step. Options include fully automated calibration, adaptive SMIF and SECS interface. Using our industry standard measurements, the 9600 can identify out of specification wafers before they cause yield loss in downstream processes. Material quality can be monitored.