Preventing distortion of sub-wavelength geometries requires enhancement techniques such as phase shift masks (PSM) and optical proximity corrections (OPC). These techniques increase the complexity of the reticle manufacturing process and impact the ability to yield defect free masks. In addition, subwavelength lithography has increased reticle defect printability and introduced new inspection challenges that require new inspection solutions that operate in the UV spectrum.
The KLA-Tencor STARlight™ SL3UV assures reticle quality as the reticles move from blanks to manufacturing and throughout their productive life in wafer fabrication. The SL3UV Series provides the most comprehensive UV contamination inspection for deep ultra-violet (DUV) lithography.