KLA Corporation Datasheets for Wafer and Thin Film Instrumentation

Instruments such as quartz crystal microbalance (QCM) monitors, ellipsometers, RHEED systems, imaging stations, CD-SEMs, ion mills, C-V systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing.
Wafer and Thin Film Instrumentation: Learn more

Product Name Notes
Product Description Enables control of overlay error budget for sub-90-nm production Provides a 25 percent increase in throughput over previous generation systems Allows consistent, reliable, and robust measurement of low-contrast...
Archer AIM+ sets the standard for lithography process control through the > 45-nm node. Based on the mature AIM technology, the system complies with the most advanced processes, meeting ITRS...
Archer XT+ is KLA-Tencor's latest generation advanced optical metrology solution for the > 45-nm node. Based on the widely adopted Archer platforms, the tool further reduces the measurement uncertainty (>50%)...
Enables control of overlay error budget for sub-0.13-micron production. Provides a 30 percent increase in throughput over previous generation tools. Allows consistent, reliable and robust measurement of low-contrast targets, including...
EtchTemp, the next-generation in-situ plasma etch wafer temperature measurement product, captures the effect of the process environment on production wafers and offers unique new capabilities to robustly characterize the high-power,...
For ultra-clean, highly accurate measurement of rigorous plasma etch temperatures, the 200mm i3 Integral SensorWafer provides a robust, cost effective plasma etch temperature measurement solution that will impress users with...
Next-generation standard for 180nm wafers Measures more than 38,000 data points Edge exclusion to 1 mm E-Plus technology emulation mode The UltraGage 9900 with E-Squared™ Gage technology is the next...
Preventing distortion of sub-wavelength geometries requires enhancement techniques such as phase shift masks (PSM) and optical proximity corrections (OPC). These techniques increase the complexity of the reticle manufacturing process and...
SensArray Process Probe 1630 instrumented wafers enable precise in-situ characterization of wafer temperature profiles in both front-end atmospheric and belt CVD systems, and in back-end wafer solder bumping reflow ovens.
SensArray’s Process Probe 1730-instrumented wafers enable precise in-situ characterization of wafer temperature profiles in photoresist track systems, for temperature controlled wafer chuck systems and oven applications. The Process Probe 1730...
SpectraFx 100, KLA-Tencor's next generation thin film metrology solution, offers cutting-edge capabilities that meet thin film measurement process control requirements for the 90nm node, including 193nm deep ultraviolet (DUV) lithography...
The 2367 UV/visible brightfield inspector provides sensitivity to a broad range of yield-relevant defect types for the 65nm and above design nodes. With significantly improved throughput over its predecessor, the...
The 2800 Series is the next-generation broadband DUV/UV/VIS patterned wafer inspection platform for sub-65-nm design rule development and production. With its multiple wavelengths, ultimate sensitivity, and extendibility, the 2800 Series...
The Aleris 8350 is a high-performance film metrology tool that meets the tighter process tolerances required for thickness, refractive index and stress measurements on critical films. The Aleris 8350 film...
The Aleris Family of film metrology tools provides reliable and precise measurement of film thickness, refractive index, stress and composition for the 32nm node and beyond. Utilizing Broadband Spectroscopic Ellipsometry...
The Candela CS20 system simultaneously measures surface reflectivity and topography for automatic defect detection and classification. The system's inspection technology combines scatterometry, ellipsometry, reflectometry, and topographical analysis to non-destructively inspect...
The i3 Integral SensorWafer is a thin (1.15mm), accurate (±0.5°C) instrumented wafer designed to provide critical wet wafer processing temperature data for emerging technology nodes. As specifications for wet cleans...
The ICOS WI-2220 is a wafer inspection tool designed specifically for LED defect inspection that assists device makers in lowering their production costs, while increasing device reliability. With the WI-2220,...
The KLA-Tencor 300 UV Series was the first reticle inspection family using UV illumination for the inspection of DUV reticles. With the higher resolution UV wavelength and new defect detection...
The KLA-Tencor STARlight"' Series provides the most comprehensive, advanced reticle contamination inspection system. Unlike other contamination inspection systems, STARlight assures reticle quality as the reticles move from blanks to manufacturing...
The Process Probe 1530 characterizes and fine-tunes your process conditions to improve equipment performance, wafer quality, and yield. The Process Probe 1530 is designed for use in temperatures ranging from...
The Process Probe 1535 instrumented wafer is ideal for process temperature monitoring of hot wall systems, and oxidizing cold wall environments. The 1535 temperature monitoring probe can be used in...
The Process Probe 1850 extends your ability to measure temperatures at a high precision for up to 350°C. With its high measurement accuracy, this is the best tool available for...
The Process Probe 2030 factory-instrumented glass panels enable in situ characterization of glass temperature profiles for CVD, PVD, and a wide range of other flat panel processing applications. The Process...
The Process Probe 2050 glass panel sensor instrumented template is a cost-effective and convenient alternative to our factory-instrumented glass panels for precise in situ characterization of glass temperature profiles for...
The Process Probe 2070 instrumented glass tiles offer a cost-effective and flexible solution for reliable in situ characterization of glass temperature profiles many flat panel processing applications. Employing a number...
The Puma 91xx Series is a family of laser imaging, darkfield patterned wafer inspectors that effectively disposition wafers and improve the predictability of the chipmaking process by capturing critical defects...
The RS-100 resistivity measurement system is a production worthy tool used in nearly all fabs worldwide. This resistivity measurement system provides capabilities such as advanced automation and improved edge performance...
The RS-200 resistivity mapping system based on proven industry resistivity mapping standards provides accurate and reliable sheet resistance measurement for 45 nm and beyond. This resistivity mapping system provides capabilities...
The SensArray Process Probe 1840 instrumented wafers provide accuracy previously unattainable in real- time hot plate temperature measurements. With up to 34 RTDs (resistance temperature devices), the 1840 can be...
The SmartFOUP and SmartBox deployment platforms are built upon wireless technology expertise. Each deployment platform device contains a fully sealed on-board diagnostics system that provides the “intelligence” while maintaining a...
The SpectraCD-XTR optical CD/profile metrology system delivers improved precision accuracy, and tool-to-tool matching at the highest throughput and lowest cost-of-ownership (CoO) available. Evolved from the industry-leading, fourth-generation SpectraCD-XT system, the...
The Surfscan SP1DLS unpatterned wafer inspection system captures yield-limiting defects down to 50nm at high throughput, accelerating yield learning across all process modules at the 0.13µm design rule and...
The Surfscan SP2 unpatterned wafer surface inspection tool provides the sensitivity and throughput required for qualification of current and next-generation substrates, as well as qualification and monitoring of process tools.
The Surfscan SP2XP unpatterned wafer surface quality inspection system inspects bare wafers and blanket films with sensitivity, throughput and defect classification improvements from its predecessor, the Surfscan SP2. The Surfscan...
The TeraScanHR Reticle Defect Inspection System provides powerful technology and productivity features that enable the production of defect free reticles for 45nm. The new defect inspection system includes higher resolution...
The TeraScanXR reticle inspection system brings high-resolution reticle-, aerial-plane and wafer-plane inspection capability to the 32nm node. This new inspection tool, an extension of existing TeraScan reticle inspection systems, is...
The Teron 600 platform for reticle defect inspection at the 2Xnm logic (3Xnm half-pitch memory) node will feature higher resolution and greater defect capture rates versus the current industry-standard platform,...
The UltraScan 9800 system, with E-Squared™ Gage technology, is the next generation industry standard for wafer geometry characterization and sorting. The 9800 meets SIA performance requirements for 200mm wafer processing.
The wireless Integrated Wafer Process system is a unique tool for monitoring and maintaining your semiconductor manufacturing processes. Without disrupting the production process, this low profile wafer can travel through...
Thermal MAP® 3 is the most intelligent acquisition and analysis system available for measuring in situ wafer temperature. This sophisticated wafer temperature measurement system provides outstanding accuracy, precision, and...
Adjusts dynamically to all die regions to deliver maximum sensitivity and improved detection of killer defects in a single scan, regardless of pattern density. Features faster recipe setup, fewer setup...
Double-darkfield laser scanning technology High defect sensitivity and throughput control for critical yield limiting defect types Defects reported in small region of interest, then can be binned and reviewed with...
Higher throughput and sensitivity to meet 65-nm production requirements Offers a wide range of spot sizes for optimum speed and sensitivity-1.8 um spot delivers optimal sensitivity and enables detection of...
Most comprehensive and lowest cost-of-ownership reticle defect inspection solution for sub-90nm design rules Industry-leading sensitivity to detect classical defects (intrusions, extrusions, and point defects) as small as 80nm, and critical...
Multi-tool functionality including thickness, shape stress, global and site flatness measurements Measures 8,700 data points in under 60 seconds Thin film stress on patterned or monitor wafers Wide range of...
Multi-tool functionality including wafer thickness, shape, global and site flatness Measures up to 8,700 data points per wafer Up to 40 sort classes available Optional resistivity and type measurement The...
New overlay grating targets dramatically improve stepper correction accuracy, provide data that correlates precisely to in-device overlay performance, enable design rule segmentation by layer to meet specific customer requirements, and...
Offers <0.08 micron particle sensitivity on polished silicon wafers Exceptional sensitivity to microscratches for automatic wafer surface inspection, defect detection and classification on 2" - 12" transparent and opaque wafers.
Provides 2x improvement in throughput over previous generation tool Uses UV and visible light source and 0.12-mm pixel size to provide the improved inspection sensitivity needed for 65-nm node and...
Provides process control information beyond one-dimensional CD. Offers real-time site-by-site CD, height or depth, sidewall angle and profile information with each measurement for maximum productivity. Performs thin film and CD...
The standard for wafer dimensional measurements High performance metrology Configurable multi-cassette sorting capabilities Wide variety of options including fully automated calibration The UltraScan 9600 system, with E-Plus Gage technology, is...
The standard for wafer dimensional metrology Measures 17,300 data points in 60 seconds Edge exclusion to 2mm E technology emulation Pass/Fail Sorting Applications Polished wafers Patterned wafers MEMS substrates Broad...
Uses a shorter wavelength light source and smaller pixel size to provide the improved imaging inspection sensitivity needed for 90-nm node and below design rules Selectable UV illumination (Broadband UV,...