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High Strength Adhesive Sealant, Bonds To Most Substrates Non-Silicone Thermal Conductive Pad Momentive RTV5249 Grey Electronic Silicone 310ml Nanosilica Filled, Optically Clear Epoxy Adhesive
High Strength Adhesive Sealant, Bonds To Most Substrates Non-Silicone Thermal Conductive Pad Momentive RTV5249 Grey Electronic Silicone 310ml Nanosilica Filled, Optically Clear Epoxy Adhesive
Part Number ELASTOSIL® E 951 2641041 N800AH MOSI01125 EP113
Supplier Wacker Chemical Corp. RS Components, Ltd. Shiu Li Technology Co., Ltd Techsil Limited Master Bond, Inc.
Industrial Sealants from Wacker Chemical Corp.

High Strength Adhesive Sealant, Bonds To Most Substrates -- ELASTOSIL® E 951

High Strength Adhesive Sealant, Bonds To Most Substrates -- ELASTOSIL® E 951 -- View Larger Image
High Strength Adhesive Sealant, Bonds To Most Substrates -- ELASTOSIL® E 951-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Silicone
Cure / Technology
Single Component; Reactive or Moisture Cured
Type / Form
Grease, Paste
Substrate Compatibility
Ceramic, Glass; Metal; Rubber or Elastomer; Dissimilar Substrates
Viscosity
 
Tensile (Break)
 
Elongation