Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is an exceptionally low 0.0003 inches/in. An even lower viscosity version called EP30LV is also available. Master Bond Polymer System EP30 produces high strength, rigid bonds which are remarkably resistant chemicals including water, oil and most organic solvents, as well as cold sterilants, ETO and gamma radiation. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. The color of part A is clear and part B clear. Master Bond Polymer System EP30 is widely used in electronic, electrical, computer, optical, metalworking, appliance, automotive and chemical industries.