Industrial Sealants from Master Bond, Inc.

Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1

 
 
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1 -- View Larger Image
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Single Component
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
 
Industry
 
Viscosity
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Tensile (Break)