Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at evelated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30P produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil, acids, and many orgainc solvents. It is serviceable over the wide temperature range of -60°F to + 250°F. It bonds well to a wide variety of substrates including metals, glass, ceramics, and many plastics, especially polycarbonates and acrylics. EP30P has exceptionally low linear shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled with its low viscosity, makes it an excellent encapsulating and potting compound. EP30P is widely used in fiberoptics, electro-optics, optical, and related industries. EP30P can be conveniently dispensed with a gun type mixing device.