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Two Component, Optically Clear, Low Viscosity Epoxy High Temperature Resistant Epoxy Compound One Component, Storage Stable Epoxy Resin Thermally Conductive, Room temperature Curing Epoxy B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation
Two Component, Optically Clear, Low Viscosity Epoxy High Temperature Resistant Epoxy Compound One Component, Storage Stable Epoxy Resin Thermally Conductive, Room temperature Curing Epoxy B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation
Part Number EP30P EP45HT EP19HTLV EP21AOHT FLM36
Supplier Master Bond, Inc. Master Bond, Inc. Master Bond, Inc. Master Bond, Inc. Master Bond, Inc.
Composition Filled Unfilled Unfilled Filled Unfilled
Cure / Technology Thermoset; Two Component   Thermoset; Two Component   Thermoset; Single Component Thermoset; Two Component   Thermoset
Industrial Sealants from Master Bond, Inc.

Two Component, Optically Clear, Low Viscosity Epoxy -- EP30P

Two Component, Optically Clear, Low Viscosity Epoxy -- EP30P -- View Larger Image
Two Component, Optically Clear, Low Viscosity Epoxy -- EP30P-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component  
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Features
 
Industry
 
Viscosity
 
Use Temperature
 
Dielectric Strength
 
Index of Refraction