Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient one to three mix ratio by weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AN is suitable for potting and encapsulation very thick as well as thin sectioned configurations. This epoxy resin compound exhibits superior tensile shear together with excellent peel strength for bonding and sealing applications. It produces durable high quality bonds on many different substrates including metals, glass, ceramics wood, vulcanized rubber and many plastics. The hardened composition is an excellent electrical insulator with outstanding resistance to chemicals erosions from water and gasoline to numerous acids bases and salts. Service temperature range is from -300°F to 250°F. It has even been employed successfully in a number of cryogenic applications. Master Bond EP21TDC-2AN is widely used in the electronic, electrical, computer, metalworking, appliance, automobile and chemical industries where it has shown improved long term performance over various earlier employed flexible compounds such as polysulfide compositions. A heat resistance modification for service up to 350°F is also available. EP21TDC-2ANLV is the low viscosity version - mixed viscosity is >70,000cps.