Industrial Sealants from Master Bond, Inc.
Toughened One Part Epoxy for Chip Coating Applications -- Supreme 3HTND-2CCM




Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense types of thermal cycling. This fast curing system has a paste consistency that flows slightly while curing. Supreme 3HTND-2CCM passes NASA low outgassing test requirements which allow it to be used in vacuum, aerospace and clean room applications.
Specifications
Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Single Component
Type / Form
Grease, Paste
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
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