Formulated for potting, coating and sealing applications, EP113 is a two component, nanosilica filled epoxy. The nano particles enhance the dimensional stability and the already exceptionally low shrinkage upon curing. This low viscosity system bonds well to a wide variety of substrates including metals, composites, glass, ceramics and plastics. As a toughened compound, it has good resistance to thermal cycling and shock over the wide temperature range of -100°F to +450°F [-73°C to +232°C]. Additionally, this compound is a top tier electrical insulator.