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One Component, Biocompatible UV Curable Adhesive Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating One Component, Storage Stable Epoxy Resin Silicone Adhesive Features High Thermal Conductivity & Electrical Insulation
One Component, Biocompatible UV Curable Adhesive Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating One Component, Storage Stable Epoxy Resin Silicone Adhesive Features High Thermal Conductivity & Electrical Insulation
Part Number UV10Med MasterSil 170 Gel UV10TK40M EP19HTLV MasterSil 153AO
Supplier Master Bond, Inc. Master Bond, Inc. Master Bond, Inc. Master Bond, Inc. Master Bond, Inc.
Cure / Technology Thermoset; UV or Radiation Cured; Single Component Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing Thermoset; UV or Radiation Cured; Single Component; UV curing system Thermoset; Single Component Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates Ceramic, Glass; Composites; Metal; Porous Surfaces Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Industrial Sealants from Master Bond, Inc.

One Component, Biocompatible UV Curable Adhesive -- UV10Med

One Component, Biocompatible UV Curable Adhesive -- UV10Med -- View Larger Image
One Component, Biocompatible UV Curable Adhesive -- UV10Med-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Polyurethane
Cure / Technology
Thermoset; UV or Radiation Cured; Single Component
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Features
High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
Industry
 
Viscosity
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Tensile (Break)
 
Elongation
 
Dielectric Constant
 
Transmission