Industrial Sealants from Master Bond, Inc.
Thermally Conductive, USP Class VI approved Epoxy Adhesive -- EP21AOLV-2Med
Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold sterilants. This electrically isolating epoxy is well suited for bonding, sealing, coating and encapsulation applications in the medical device industry.
Specifications
Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Features
High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
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