Industrial Sealants from Master Bond, Inc.

Thermally Conductive, USP Class VI approved Epoxy Adhesive -- EP21AOLV-2Med

 
 
Thermally Conductive, USP Class VI approved Epoxy Adhesive -- EP21AOLV-2Med -- View Larger Image
Thermally Conductive, USP Class VI approved Epoxy Adhesive -- EP21AOLV-2Med-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Features
High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant