Industrial Sealants from Master Bond, Inc.
One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion -- EP13LTE
Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn't require mixing, and has an unlimited working life at room temperature. It also features high temperature resistance, dimensional stability and is able to withstand 1,000 hours at 85°C/85% RH.
Specifications
Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Single Component
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
More Information
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Master Bond, Inc.
