Industrial Sealants from Master Bond, Inc.

One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion -- EP13LTE

 
 
One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion -- EP13LTE -- View Larger Image
One component, heat curing epoxy for structural bonding applications featuring low coefficient of thermal expansion -- EP13LTE-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Single Component
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
 
Industry
 
Gap Fill
 
Use Temperature
 
Tensile (Break)
 
Dielectric Constant