Industrial Sealants from Master Bond, Inc.

Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive -- UV22DC80-1

 
 
Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive -- UV22DC80-1 -- View Larger Image
Nanosilica Filled, NASA Low Outgassing, Dual Cure Adhesive -- UV22DC80-1-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; UV or Radiation Cured; Single Component
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Features
 
Industry
 
Viscosity
 
Use Temperature
 
CTE
 
Tensile (Break)
 
Dielectric Constant
 
Index of Refraction