Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is thermally conductive and electrically insulative. This moderate viscosity compound has good flow properties and can be cast in sections up to ½ inch thick.