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Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion Heat Resistant, USP Class VI Certified Epoxy One Part, Thermally Conductive, Heat Resistant Epoxy Epoxy  Has Low Thermal Expansion Coefficient Two Component Adhesive for Food Applications
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion Heat Resistant, USP Class VI Certified Epoxy One Part, Thermally Conductive, Heat Resistant Epoxy Epoxy Has Low Thermal Expansion Coefficient Two Component Adhesive for Food Applications
Part Number EP42HT-3AO EP45HTMed EP36AO EP30LTE EP42HT-2FG
Supplier Master Bond, Inc. Master Bond, Inc. Master Bond, Inc. Master Bond, Inc. Master Bond, Inc.
Chemical System Epoxy Epoxy Epoxy Epoxy Epoxy
Composition Unfilled Unfilled Unfilled Filled Unfilled
Industrial Sealants from Master Bond, Inc.

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO -- View Larger Image
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
 
Industry
 
Viscosity
 
Gap Fill
 
Use Temperature
 
CTE
 
Tensile (Break)
 
Elongation
 
Dielectric Constant