Industrial Sealants from Master Bond, Inc.
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
Specifications
Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates