Industrial Sealants from Master Bond, Inc.

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO

 
 
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO -- View Larger Image
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion -- EP42HT-3AO-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
 
Industry
 
Viscosity
 
Gap Fill
 
Use Temperature
 
CTE
 
Tensile (Break)
 
Elongation
 
Dielectric Constant