Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500°F, outstanding ther-mal shock resistance and high thermal conductivity over the exceptionally wide temperature range of +500°F to -80°F, superior physical strengths, excellent adhesion to both metallic and nonmetallic substrates, a high degree of chemical resistance plus remarkably good electrical insulation characteristics. Master Bond Polymer System EP36AO offers the additional application convenience of a one component system together with flexible cure schedules so as to best meet specific processing requirements. Master Bond Polymer System EP36AO is supplied as a solid and has minimum stability of 3 months when stored at temperatures of around 75 + 5°F. It liquifies readily above 180°F and can be cured at temperatures ranging from 250°F to 350°F and higher. Gel times and cure schedules depend primarily upon temperature. A typical gel time is 30 minutes at 280°F. Full cure can be achieved by further heating for about 2-2½ hours at 300°F or shorter time periods at higher temperatures. Pertinent physical properties of the Master Bond Polymer System EP36AO are summarized in Table #1. Master Bond Polymer System EP36AO fully meets Class H service requirements for insulation. lt has successfully withstood more than 1000 hours of service temperatures as high as 500°F. A two component version with substantially longer storage stability is available.