Industrial Sealants from Master Bond, Inc.

Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE

 
 
Epoxy  Has Low Thermal Expansion Coefficient -- EP30LTE -- View Larger Image
Epoxy  Has Low Thermal Expansion Coefficient -- EP30LTE-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component  
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Features
 
Industry
 
Viscosity
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Tensile (Break)
 
Elongation
 
Dielectric Strength
 
Dielectric Constant
 
Index of Refraction