Industrial Sealants from Master Bond, Inc.

Dual Curing, Thixotropic Adhesive -- UV22DC80-10F

 
 
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F -- View Larger Image
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F-Image

Specifications

Product Category
Industrial Sealants
Composition
Filled
Cure / Technology
UV or Radiation Cured; Single Component; Dual Curing
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
Industry
 
Viscosity
 
Gap Fill
 
Use Temperature
 
CTE
 
Tensile (Break)
 
Dielectric Constant
 
Index of Refraction