Industrial Sealants from Master Bond, Inc.
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength.
Specifications
Product Category
Industrial Sealants
Composition
Filled
Cure / Technology
UV or Radiation Cured; Single Component; Dual Curing
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
More Information
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Master Bond, Inc.
Master Bond, Inc.
