Industrial Sealants from Master Bond, Inc.

No Mix, Thermally Conductive Epoxy Adhesive -- EP3RR-80

 
 
No Mix, Thermally Conductive Epoxy Adhesive -- EP3RR-80 -- View Larger Image
No Mix, Thermally Conductive Epoxy Adhesive -- EP3RR-80-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Single Component; Reactive or Moisture Cured
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
High Dielectric; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry
 
Viscosity
 
Use Temperature
 
Thermal Conductivity
 
Tensile (Break)
 
Dielectric Constant