Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated temperature with a convenient, non-critical one to three mix ratio by weight. The cured compound has remarkably high peel strength of more than 30 pli along with an elongation of over 150%. EP21TDC-2 develops very little exotherm while curing, making it well suited for potting or encapsulating in thicker sections. It bonds well to many substrates including metals, glass, ceramics, and a wide array of rubbers and plastics. The cured epoxy is an excellent electrical and thermal insulator with outstanding resistance to chemicals such as water, oils, hydraulic fluids, bases and salts. Master Bond EP21TDC-2 is widely used in the electronic, electrical, computer, optical, metalworking, appliance, automobile and aerospace industries where excellent flexibility and related properties are desired. EP21TDC-2 has excellent thermal cycling properties along with outstanding resistance to thermal and mechanical shock and vibration. In addition, EP21TDC-2 has wide applicability as both a adhesive and sealant in cryogenic environments. Its service temperature range is 4K to 250°F. A lower viscosity version called EP21TDC-2LV as well as a "non-drip" version called EP21TDC-2ND are also available. All three versions of EP21TDC-2 are 100% reactive and contain no solvents or volatiles.