Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at evelated temperatures. It has a 4 to 1 mix ratio by weight and contains no solvents or diluents. Master Bond Polymer System EP30Med produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most orgainc solvents, as well as cold sterilants, ETO and gamma radiation. It is serviceable over the wide temperature range of -60°F to + 250°F. it bonds well to a wide variety of substrates including metals, glass, ceramics, wood and many plastics. EP30Med has exceptionally low liner shrinkage upon cure as well as superb optical clarity. The cured compound is also an outstanding electrical insulator. This, coupled iwth its ultra low viscosity, makes it an excellent encapsulating and potting compound. In addition, EP30Med meets USP Class VI specifications, making it well suited for a variety of uses in medical devices as an adhesive, sealant and coating. EP30Med also meets FDA requirements for food compatibility.