Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties. It is formulated to cure at room temperature or more rapidly at elevated temperatures and has a ten-to-one (10:1) mix ratio by weight. Other attractive properties include superb dimensional stability and as well as superior physical strength properties. EP30AN is a low viscosity system with excellent flow characteristics, making it an ideal thermally conductive potting epoxy. EP30AN is also an excellent adhesive/sealant forming durable, rigid bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the wide temperature range of -60°F to 250°F. The coefficient of thermal expansion is desirably low. The color of part A is gray and part B is clear. Master Bond EP30AN is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and environmental protection are required and maximum heat transfer must be maintained.