Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and straightforward; 20-30 minutes at 250°F or 10-15 minute at 300°F. EP3UF is distinguished by being thermally conductive and electrically insulative by using very special filler material with ultra small particle sizes. These granules allow EP3UF to be used as an underfill in spaces as small as 10-15 microns wide. As an underfill system, EP3UF has high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing.