Industrial Sealants from Master Bond, Inc.

Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC

 
 
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC -- View Larger Image
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
 
Industry
 
Use Temperature
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant