Industrial Sealants from Master Bond, Inc.
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] and can be applied in sections as thin as 5-15 microns, resulting in a low thermal resistance.
Specifications
Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
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