Master Bond Polymer System Supreme 3HTND-1SM is a one component, exceptionally fast curing surface mount adhesive system with exceptional toughness and durability. It has high shear and peel strength for optimal bonding performance and is formulated to cure rapidly (5-10 minutes at 300°F, faster at higher temperatures). The minimum temperature cure schedule is 230°F for 30-40 minutes. Tensile shear strength as high as 1800 psi and T-peel strength in excess of 20 pli are readily obtained. As a one part system it requires no mixing and has unlimited working life. Supreme 3HTND-1SM does not require refrigeration and has a shelf life of 6 months at 75°F. Supreme 3HTND-1SM is serviceable over the wide temperature range of -100°F to 400°F. It bonds well to a wide variety of substrates and offers excellent resistance to impact, thermal shock and vibration as well as severe thermal cycling. It also resists most chemicals well including fuels, cleaning agents, oils and many solvents. Supreme 3HTND-1SM has superior electrical insulation properties, and is also available in thermally conductive/electrically insulative and electrically conductive versions as required. Supreme 3HTND-1SM is packaged in syringes for easy dispensing and has been formulated to meet the most demanding performance and quality control requirements of the printed circuit board industry. It can be readily applied with automatic or manual dispensing equipment. Some interesting dispensing characteristics of Supreme 3HTND-1SM are that it will not "tail" when dispensed and dots can be placed on top of one another if needed. It is 100% reactive, contains no solvents or volatiles and is formulated using resin with low levels of ionic impurities. The standard color is black, but other colors are available on request.