Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to electronic components. Serviceable over the wide temperature range of -100°F to +400°F, it resists chemicals rather well, including water, acids, bases and many solvents. Especially noteworthy is its low level of ionic impurities. Supreme 3HTND-2GT cures in 20-30 minutes at 250°F or in 5-10 minutes at 300°F with very low shrinkage. It can also cure in thicknesses of up to 1/8 inch if needed.